Universal Stencil for Bga IC Reballing Use Solder Paste & SMD for IC Reballing Steel Stencil

Koocu Universal BGA Reballing Stencil is designed for mobile phone IC reballing, PCB repair, and SMD soldering work. Made from high-quality alloy steel, this stencil provides a flexible and durable template for applying solder paste and forming accurate solder ball patterns on IC chips.

Universal Reballing Design

The multi-purpose BGA stencil is designed to support reballing work on various mobile ICs. Its precision holes and groove design help provide better alignment and consistent solder placement during repair.

High Temperature Resistance

The steel construction is suitable for high-temperature soldering applications. It is designed to resist wear, bulging, and deformation during repeated heating and reballing work.

Flexible & Durable Steel

The imported alloy steel construction offers a balance of flexibility and strength. With a 0.3mm overall mesh thickness, the stencil is suitable for detailed IC reballing and mobile motherboard repair.

Wide Applications

This universal stencil can be used with solder paste, soldering flux, and other reballing materials for BGA IC repair, SMD components, mobile PCB repair, and electronics servicing.

Specifications

• Brand: Generic / Koocu
• Model: Universal
• Material: Alloy Steel
• Colour: White
• Type: Android / Universal
• Thickness: 0.3mm
• Operating Temperature: -50°C to 500°C
• Usage: IC Reballing, BGA Rework, SMD Repair
• Package: 1 × BGA Reballing Stencil