MECHANIC 004 IC Chip Glue Remover Scraper Set
Product Overview
The MECHANIC 004 IC Chip Glue Remover Scraper Set is a precision repair tool designed for mobile phone motherboard maintenance, BGA chip work, and glue removal. Its specialized blade shape helps technicians clean adhesive and solder paste from delicate areas during professional electronics repair.
Multifunctional Repair Tool
This tool can be used for several repair tasks, including CPU and BGA chip cleaning, motherboard sealant removal, UV glue cleaning, and solder paste scraping. It is especially useful for detailed work on mobile phone motherboards.
Crescent Knife Design
The crescent-style blade is designed for working around iPhone A8, A9, A10, A11, and A12 CPU/BGA chips. Its shape allows technicians to access areas around chips for controlled cleaning and repair work.
Curved Cleaning Blade
The crooked or curved blade is suitable for removing motherboard sealant and adhesive glue. It can also be used as a pry and cleaning tool during mobile phone motherboard disassembly and repair.
BGA & Solder Paste Applications
The scraper is suitable for BGA repair, UV glue removal, and solder paste cleaning. Its multifunctional design makes it a useful addition to professional mobile phone repair toolkits.
Applications
MECHANIC 004 is ideal for mobile phone motherboard repair, CPU/BGA chip cleaning, sealant removal, UV glue cleaning, and solder paste scraping.
Package Includes
- 1 × MECHANIC 004 IC Chip Glue Remover Scraper Tool

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