MECHANIC UV559/UV223 BGA Lead-free Solder Paste for BGA CPU SMD Rework Repair

MECHANIC UV559/UV223 BGA Lead-Free Solder Paste – CPU & SMD Rework Repair

Product Overview

The MECHANIC UV559/UV223 BGA Lead-Free Solder Paste is designed for precision electronics repair, especially BGA, CPU, CSP, and SMD rework. It helps technicians create clean and reliable solder joints during motherboard repair, component replacement, and BGA ball rework.

Effective Soldering Assistance

During the soldering process, the paste helps remove surface oxides and reduce surface tension on the materials being soldered. This supports better solder flow and improved contact between the solder and repair area.

Low-Residue Formula

The paste leaves a very light-colored residue after soldering and offers a high SIR (Surface Insulation Resistance) value. This makes it suitable for precision board-level repair where clean soldering and controlled residue are important.

BGA & SMD Applications

MECHANIC UV559/UV223 is recommended for BGA and CSP ball-array solder joint repair, CPU rework, SMD component soldering, motherboard maintenance, and other precision electronics applications.

Convenient Nozzle Design

The product comes with three nozzles, making application easier and allowing technicians to apply the solder paste accurately to the required repair area.

Specifications

• Brand: MECHANIC
• Model: UV559 / UV223
• Type: Lead-Free BGA Solder Paste
• Applications: BGA, CPU, CSP, SMD & PCB Rework
• Main Functions: Oxide Removal & Surface Tension Reduction
• Residue: Very Light Color
• SIR Value: High
• Nozzles Included: 3
• Suitable For: BGA Ball-Array Solder Joint Repair