Mechanic UV50 Halogen-Free Flux Paste

MECHANIC Lead-Free Solder Paste UV10 / UV11 / UV35 / UV50 / UV80

The MECHANIC Solder Paste is designed for reliable soldering and rework of electronic components. It is suitable for mobile phone repair, PCB boards, BGA components, SMD chips, and other electronics repair applications.

This solder paste combines solder powder, flux, and other materials to provide good adhesion before soldering and a strong connection after heating. Its lead-free and halogen-free formula makes it a practical choice for professional and everyday electronics repair work.

Key Features

• Brand: MECHANIC
• Models: UV10, UV11, UV35, UV50, UV80
• Type: Solder Paste
• Lead-Free: Yes
• Halogen-Free: Yes
• Environment Friendly: Designed with a lead-free formula
• Suitable for Mobile Phone Repair
• Suitable for PCB and SMD Rework
• Useful for BGA Chip Repair
• Helps hold components in position before soldering
• Provides a permanent solder connection after heating

Suitable Applications

MECHANIC solder paste can be used for various electronic repair and rework jobs, including:

• Smartphone motherboard repair
• PCB soldering
• SMD component rework
• BGA chip repair
• Electronic component installation
• General electronics repair

Important Storage & Usage Instructions

• Keep the solder paste away from children.
• Avoid contact with eyes and prolonged contact with skin.
• Use the product in a properly ventilated area.
• The paste contains organic solvents, so avoid repeatedly getting it on your skin.
• If it comes into contact with skin, clean it with alcohol and wash thoroughly with water.
• Avoid directly breathing the vapor or smoke produced during operation.
• Keep the solder paste at room temperature and away from direct sunlight.
• For best results, maintain a working temperature of approximately 22–28°C with 30–60% RH humidity.
• Before opening, allow the solder paste to reach approximately 25°C naturally. This may take around 3–4 hours.
• Do not use heaters or other methods to heat the paste quickly.
• After opening, it is recommended to use the paste within 24 hours when kept at room temperature.
• Long exposure to air and moisture can cause the solder paste to harden or form tin blocks.
• For cleaning an incorrectly applied substrate, industrial alcohol or a suitable industrial cleaner is recommended.
• The recommended usage period is 12 months when properly stored.

Product Information

Solder paste is commonly used in SMT (Surface Mount Technology) applications. It contains solder powder, flux, and additional materials mixed into a paste form.

At room temperature, the paste has enough viscosity to temporarily hold electronic components in their required positions. During the soldering process, heat causes the solder material to melt while the solvent and some additives evaporate. The melted solder then bonds the component to the PCB pad, creating a strong and lasting electrical connection.

Note

The actual product color may look slightly different from the images due to lighting and different screen settings. Measurement variations of approximately ±1 cm / ±1 g may occur.

Product packaging may be updated from time to time to help prevent counterfeit products. The packaging may therefore differ from the images, but this does not affect the product’s quality or performance. Old or new packaging may be shipped depending on availability.

The weight shown in the product information or images refers to the gross weight. Different models may mainly vary in their available weight options.