MECHANIC R350 Desoldering Wick Wire 1.5mm × 1.5m – Pure Copper Solder Removal Braid
Product Overview
The MECHANIC R350 Desoldering Wick Wire is designed for clean and controlled solder removal during mobile phone, tablet, motherboard, BGA, and SMD repairs. Made from pure copper braid, it quickly absorbs molten solder and helps technicians prepare PCB pads for component replacement, reballing, and rework.
Fast Solder Absorption
The double-layer braid structure provides strong tin absorption and helps remove solder evenly from repair points. The 1.5mm width is suitable for fine-pitch motherboard work, allowing better control around small pads and sensitive components.
Pre-Coated with Flux
The wick comes pre-coated with flux to support faster solder absorption without requiring additional flux in many repair situations. It helps reduce leftover solder and leaves minimal residue, making the board easier to clean before reflow or component installation.
Wide Repair Applications
This desoldering braid is suitable for removing solder from charging ports, ICs, PMICs, SMD components, BGA pads, and motherboard repair points. It can also be used when preparing PCB pads before IC replacement or reballing.
Durable Copper Construction
The copper braid features anti-oxidation and anti-corrosion treatment to maintain reliable solder absorption during storage and repeated repair work. Its 1.5-meter length provides enough material for multiple repair jobs.
Specifications
- Brand: MECHANIC
- Model: R350
- Type: Desoldering Wick / Solder Removal Braid
- Width: 1.5mm
- Length: 1.5m
- Material: Pure Copper
- Structure: Double-Layer Strong Tin Absorption
- Flux: Pre-Coated
- Applications: Mobile Phone, Tablet, PCB, BGA, SMD, IC Repair
- Suitable For: Board-Level Repair and Solder Rework

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