MECHANIC iSm5 [3ML]183℃ Specific Paste For Jump Wire

MECHANIC iSm5 is a special solder paste designed for jump wire and motherboard repair. It uses a Japanese-inspired industrial-grade nano compound formula with high activity and moderate viscosity. The paste is easy to apply and helps the solder wire or iron tip pick up solder quickly.

High Activity Formula

The high-activity formula helps improve solder flow and adhesion on small repair points. Only a small amount is needed on the solder spot, making it suitable for precise board-level work.

Easy Tinning

MECHANIC iSm5 is designed for quick and smooth tinning. A light touch of the soldering iron can help apply solder evenly to the repair point, making delicate jumper wire work easier.

Jump Wire Repair

This special paste is suitable for mobile phone motherboard repair, jumper wire work, pad repair, and other precision soldering tasks where controlled solder application is important.

Specifications

• Brand: MECHANIC
• Model: iSm5
• Product Type: Special Solder Paste for Jump Wire
• Volume: 3ML
• Melting Temperature: 183°C
• Activity: High
• Viscosity: Moderate
• Package: 3 Pieces with Needles
• Application: Jump Wire and PCB Repair